To provide context, the following links are images of the PCBs I need to assemble:http://www.iceapps.com/img_6706.jpg
== top of larger PCB : small PCBhttp://www.iceapps.com/img_6721.jpg
== bottom of larger PCB : small PCB
T: u01 is a BGA - EP3C5F256C8N - 256 balls
T: u02 is a QFP - C8051F120 - 100 pins
T: u03 is a QFP - 88E1111 - 128 pins
T: u05 is a BGA - CY7C1041DV33 - 56 balls
T: u06 is a BGA - CY7C1041DV33 - not always stuffed
T: u07 is a BGA - CY7C1041DV33 - not always stuffed
B: u10 is a QFN - max8717 - 28 pads - 0.50mm
B: u11 is a QFN - max8717 - 28 pads - 0.50mm
T: u20 is a QFN - 74LVC163BQ - 16 pads (u20 ~ u29)
T: u30 is a BGA - 74AUC16244 - 48 balls
T: u31 is a BGA - 74AUC16244 - 48 balls
T: u32 is a BGA - 74AUC32374 - 96 balls
T: top side
B: bottom side
The solo IC in the center of the top side of the small PCB is a 48-pad iLCC "image sensor". The iLCC package is pretty much the same as a QFN, except of course the top surface of the package is a glass window to let the image fall upon the image sensor. The other ICs on the small PCB (on the other side) will not usually be stuffed (though all the caps near the center of the PCB will be stuffed to bypass the 3 voltages the image sensor requires).
For me, "pick-and-place" isn't just for fun, it's for:
----- placing 0201 caps (see bottom side of BGA components on the larger PCB)
----- placing all BGAs precisely
----- placing all QFNs precisely
I can handle 0402s manually just fine. And maybe with a stereo microscope, vacuum pick-up pencil, and enough practice, I can handle the 0201s too. But so far at least, I cannot make myself believe that I can precisely place BGAs and QFNs by hand... EVERY TIME (which is what I need).
PS: I'm posting this message in the other two active PaP threads too, just in case.