typically for reflow, there is the ramp up, soak, reflow, and cool down. Will the osPID be capable of handling the temperature profile?
And if you are using a thermocouple, where is the cold junction?
I was designing my own controller and was planning on using MC3063 opto isolated switch with L4008D6 triac to control the on/off of the toaster oven. heating element would be PWM'd
But if you have a working solution, I prefer not to reinvent the DIY wheel. And I also have more pressing projects at the moment.
A descent reflow oven would be nice but for now I just did ballistic approach (open loop), place the populated board in a "cold" toaster oven, turn the oven to about 150F wait for about 4 minutes. Crank the heat on high, wait for reflow to melt. Turn off the oven, wait 30 seconds, cracked open the front door, then opened all the way after 2 minutes. and carefully pulled out the board. I had 44TQFP CPLD, 24 SSOP, 48 TSSOP, several SOT-23, and whole bunch of 1210 sized parts. feature size of the board 7/7 width/space on trace. smallest via 16mil. components on both sides. 1210 is about small as I want to go. Did have few 0804 parts. Had two minor bridge on the TSSOP part. And oh I did use a stencil for the paste.
What about a small fan inside to get more even heating in the toaster oven?
And oh my first post here. quick bio. yes I'm an engineer. Used to be a mixed signal ASIC designer. VHDL can do. SPICE can do... Forced into early retirement. Do I know a lot NO.
There is so much still to learn.