I'm curious how reflowing QFN parts with solder paste been working out for other people here? I get the occasional bridge with QFP, but it's simple to fix it up with an iron ... the QFN's (ADXL335, etc.) are more of a pain in the ass to inspect and repair when you do get a bridge, though, even with elongated pads to make them iron-friendly. (One of the problems with lead-free solder is that you need to work with a ~350°C iron, and it's really easy to lift the pads at those temperatures so you want to avoid manual rework as much as possible.)
I've been thinking about manually making my paste layer on the individual pads in Eagle smaller than the pads themselves to reduce bridging? By default Eagle makes the paste (cream) layer the same size as the pads, but I think this promotes bridging since you have more paste than you need on the pads and it has no where to go except next door in that case. I've been meaning to go into all my footprints and do this (I think a paste layer 1/2 the size and in the middle of the pad should be ideal), but it isn't that fun so I've been putting it off and I'm not sure how the smaller holes will work out on the stencils. Just wondering what other people are doing to reduce bridging on fine-pitch parts before reworking my entire Eagle library. I'm keen to avoid manual rework, or at least minimise it as much as possible, but maybe other people have some tips on optimising the paste layer?

