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prototyping for TIs FDC1004 (VSSOP packaging)
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prototyping for TIs FDC1004 (VSSOP packaging)

by pokui on Wed Mar 29, 2017 5:57 pm

Hi all,

I'm trying to prototype with TI's FDC1004 as seen at http://www.ti.com/lit/ds/symlink/fdc1004.pdf . I'd be ordering the package with gull-wing leads.

I'd have loved to use one of the AdaFruit SMD breakout kits or the ZIF sockets, but am I right in surmising that the only product with the 0.5 pitch between leads that would work is this one https://www.adafruit.com/product/1212 which sadly has only 8 (instead of my required 10) pads?

If I've skipped a product that can help me breadboard this, please point me in the right direction. In the meantime, I'm working on a custom PCB.

pokui
 
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Re: prototyping for TIs FDC1004 (VSSOP packaging)

by adafruit_support_mike on Thu Mar 30, 2017 12:23 am

You can use the 12-pin version: https://www.adafruit.com/products/1211

You'll have a couple of empty pads, but that won't make any difference electrically.

adafruit_support_mike
 
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Joined: Thu Feb 11, 2010 2:51 pm

Re: prototyping for TIs FDC1004 (VSSOP packaging)

by pokui on Thu Mar 30, 2017 2:08 am

Thanks Mike.

I saw that one but I am not sure what made me think the pads on each side were more than 0.5mm apart.

I'll happily order a batch of these for when I'm in a similar dilemma.

pokui
 
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Joined: Sun Mar 19, 2017 6:53 pm

Re: prototyping for TIs FDC1004 (VSSOP packaging)

by adafruit_support_mike on Sat Apr 01, 2017 11:58 pm

You may have seen the SOIC side. Those are on 0.95mm pitch. Each breakout has two footprints though: SOIC on one side, SSOP on the other.

adafruit_support_mike
 
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Please be positive and constructive with your questions and comments.