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T200 Reflow oven cooling
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T200 Reflow oven cooling

by Dan.Grlx on Wed Jun 26, 2013 7:45 pm

The T200 bench top oven. I'm getting 0.9C per second cooling. Is the PCB board cooling down to slow?
Not sure if you are suppose to open drawer after reflow to cool PCB board faster. I read somewhere that pcb should not cool down faster the 6C per second. So cooling it down too fast is not good?yes/no?
Dan.Grlx
 
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Re: T200 Reflow oven cooling

by alphatronique on Wed Jun 26, 2013 9:22 pm

Qoute ... From solder past Datasheet ...

Cooling Stage:
A rapid cool down is desired to form a fine grain structure.
Slow cooling will form a large grain structure, which typically
exhibits poor fatigue resistance. The acceptable cooling
range is 0.5°C-6.0°C/second (2.0°-6.0°C/second is ideal).

P.S. over 6 Deg second you will make thermal stress to PCB and risk of wrap it ..
normally on batch drawer type oven you open door for help coling
Best regard
Marc Lalonde CID.
IPC Certified PCB Designer.
Alphatroniqe inc.
www.alphatronique.com
http://ca.groups.yahoo.com/group/MyData_Group

alphatronique
 
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