Problems applying the right amount of Solder Paste
As you can see from these photos, I'm having a hard time applying solder to pads for QFN parts with 0.5mm and below pad sizes. The stencil is 5mm thick, hence the pile.
If I were to placed a component on these pads and use my re-flow oven, I will surly get bridging.
And help would be greatly appreciated.